Description
One side: Bambu High-Temperature Plate = High-Temp sheet + Bambu Engineering Plate
The other side: Bambu Engineering Plate
1.Bambu High-Temperature Plate
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
Material | Heatbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? |
PLA/PLA-CF/PLA-GF | 45~65℃ | No | Yes |
PETG/PETG-CF | 60~80℃ | Yes | No |
ABS | 90~100℃ | Recommended | No |
ASA | 90~100℃ | Recommended | No |
TPU | 35~45℃ | Recommended | Yes |
PVA | 45~60℃ | Recommended | Yes |
PC/PC-CF | 100~110℃ | Yes | No |
PA/PA-CF/PAHT-CF | 100~110℃ | Yes | No |
PET-CF | 80~100℃ | Yes | No |
Benefits
Works best with most 3D printing filaments
Works well with the Automatic Calibration for Flow rate and does not interfere with the LIDAR
Smooth texture on the surface of the print
Excellent adhesion and easy print removal
Can be replaced by the user
Downsides
It cannot be used without heating the printing surface
Can be more fragile compared to the Engineering Plate or Textured PEI Plate
The upper glass cover plate, or the front glass door need to be opened for filaments with a low glass transition temperature
2. Bambu Engineering Plate
Please note that other slicer settings might need to be adjusted based on the printed model and the filament requirements
Material | Heatbed Temperature | Glue Stick Required? | Upper Glass Cover Plate Removed? |
TPU | 30~35℃ | Recommended | No |
PETG/PETF-CF | 70~80℃ | Recommended | Yes |
PET-CF | 70~80℃ | Recommended | Yes |
ABS | 100~110℃ | Yes | No |
PC/PC-CF | 100~110℃ | Yes | No |
PA/PA-CF/PATH-CF | 100~110℃ | Yes | No |
Product Specification
Material |
Smooth PEI sheet + Spring steel + Engineering Coating
|
Surface temperature resistance
|
Up to 120℃ |
Flexible spring steel thickness |
0.4 mm
|
High-temp Plate sticker thickness
|
0.03 mm
|
Usable print size
|
256*256 mm
|
Package size
|
290*290*4 mm
|
Package weight
|
450 g
|
Color
|
Black
|